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Semiconductor Equipment Spending to Fall to Six-Year Low in 2009     Date added: Dec 9, 2009
 

 

Semiconductor Equipment Spending to Fall to Six-Year Low in 2009

Semiconductor Equipment Spending to Fall to Six-Year Low in 2009

Tuesday, December 09, 2008 Semiconductor Equipment Spending to Fall to Six-Year Low in 2009 Following a dismal 2008, global spending on semiconductor manufacturing equipment in 2009 will fall to its lowest level in six years, due to weakening conditions in the chip and electronic equipment markets, according to iSuppli Corp.

iSuppli anticipates that worldwide capital spending by chip makers on semiconductor manufacturing equipment in 2009 will decline to $35.2 billion, down 17.6 percent from 2008. This will mark the lowest level of spending since 2003, when semiconductor capital spending amounted to $33.8 billion.

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Our Products Includes:

Supported PV Applications: 

  • Polysilicon filament prep

  • Chunk / slab polysilicon reprocessing prep

  • Crushed / pelletized polysilicon metal mitigation

  • Saw damage etching

  • Wafer texturing

  • Wafer cleaning

  • Oxide etching stripping

  • Pattern develop

  • Silicon feature etch (acidic or caustic)

  • Resist strip

 

 

For the photovoltaic / solar industry, we provide a full range of products which serve the great breadth of current research & development and production requirements. This includes versatile manual wet stations for early development of break-through silicon, CIS-thin-film, Silicon/GaAs technologies and Nanotechnology, as well as wet benches fully automated large batch processing systems for mainstream production applications. Thus, customers have the ability to enter production with the same processing technology as they developed their products on.

Many of our innovative customer solutions for wet benches include unique fixtures required to handle substrates that are of uncommon size, shape, rigidity, weight, and/or material, or which must be compatible with physical changes that occur during the wet process. Substrates which we have designed unique solutions for include: elements of up to 3,000mm in length, lenses of 1,200 pounds in weight, crushed material of 1mm grain size and flexible metal panels of <0.007” thickness.

Amerimade also Manufactures wet processing for Medical Device Equipment for Polishing Stents, Catheters, Micro Parts.  key: medical device equipment, Medical Devices needing polishing for stent, drug coated stents and micro machining wet benches, stripping and etching, cleaning with ultrasonic. Visit our product page to review all our wafer process systems and accessories.

-- Amerimade Wet Benches -- Amerimade Wet Bench -- Amerimade Used Wet Benches

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