News & Information
|
|||||||||||||||||||||||||||||||||
|
North American Semiconductor Equipment Industry Posts July 2009 Book-to-Bill Ratio of 1.06 SAN JOSE, Calif. – August 18, 2009 – North America-based manufacturers of semiconductor equipment posted $569.7 million in orders in July 2009 (three-month average basis) and a book-to-bill ratio of 1.06, according to the July 2009 Book-to-Bill Report published today by SEMI. A book-to-bill of 1.06 means that $106 worth of orders were received for every $100 of product billed for the month. The three-month average of worldwide bookings in July 2009 was $569.7 million. The bookings figure is about 62 percent greater than the final June 2009 level of $351.7 million, and about 36 percent less than the $889.0 million in orders posted in July 2008. The three-month average of worldwide billings in July 2009 was $538.0 million. The billings figure is just over 22 percent greater than the final June 2009 level of $440.5 million, and about 50 percent less than the July 2008 billings level of $1.077 billion. "The increases in both bookings and billings reported by North American equipment manufacturers boosted the book-to-bill ratio above parity for the first time since January, 2007.” said Stanley T. Myers, president and CEO of SEMI. “Even with that improvement, however, bookings remain significantly below year-ago figures.” The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.
Source: SEMI August 2009 The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data. The data are contained in a monthly Book-to-Bill Report published by SEMI. The report tracks billings and bookings worldwide of North American-headquartered manufacturers of equipment used to manufacture semiconductor devices, not billings and bookings of the chips themselves. The Book-to-Bill report is one of three reports included with the Equipment Market Data Subscription (EMDS). SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries. SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Austin, Bangalore, Beijing, Brussels, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org. Association Contacts Dan Tracy/SEMI Tel: 1.408.943.7987 E-mail: dtracy@semi.org Steve Buehler/SEMI Tel: 1.408.943.7049 E-mail: sbuehler@semi.org Editors Note: Next SEMI Book-to-Bill: September 17, 2009; 3:00 p.m. PST For information on SEAJ Book-to-Bill Report, visit www.seaj.or.jp |
|||||||||||||||||||||||||||||||||
Welcome to Amerimade Technology Inc.
|
SUPERIOR PERFORMANCE LOW COST OF OWNERSHIP KNOWLEDGEABLE STAFF |
TOP SERVICE & SUPPORT DESIGNED FOR SAFETY EASE OF USE OPERATOR CONTROLS |
|
Our Products Includes:
|
Supported PV Applications:
|
For the photovoltaic / solar industry, we provide a full range of products which serve the great breadth of current research & development and production requirements. This includes versatile manual wet stations for early development of break-through silicon, CIS-thin-film, Silicon/GaAs technologies and Nanotechnology, as well as wet benches fully automated large batch processing systems for mainstream production applications. Thus, customers have the ability to enter production with the same processing technology as they developed their products on.
Many of our innovative customer solutions for wet benches include unique fixtures required to handle substrates that are of uncommon size, shape, rigidity, weight, and/or material, or which must be compatible with physical changes that occur during the wet process. Substrates which we have designed unique solutions for include: elements of up to 3,000mm in length, lenses of 1,200 pounds in weight, crushed material of 1mm grain size and flexible metal panels of <0.007” thickness.
Amerimade also Manufactures wet processing for Medical Device Equipment for Polishing Stents, Catheters, Micro Parts. key: medical device equipment, Medical Devices needing polishing for stent, drug coated stents and micro machining wet benches, stripping and etching, cleaning with ultrasonic. Visit our product page to review all our wafer process systems and accessories.
-- Amerimade Wet Benches -- Amerimade Wet Bench -- Amerimade Used Wet Benches
